≦ 150 nm
resolution
An excimer laser stepper designed for IoT1 and power devices.
resolution
exposure area
overlay accuracy
wafer sizes
Designed for high-productivity manufacture of semiconductors for IoT and power devices, the Canon FPA-3030EX6 is compatible with a variety of special substrates and existing equipment.
Handles substrates of various materials, sizes and thicknesses used for IoT & power devices.
Delivering the highest levels of resolution, overlay accuracy, and throughput in its class.
Utilise existing facilities thanks to the FPA-3000EX6-compatible reticles and recipes.
Resolution
≦ 150 nm
Wafer size
200 mm; 150 mm; 125 mm; 100 mm
Overlay accuracy
≤25 nm (|m| + 3σ)
Exposure area
22 mm x 22 mm
Reticle size
6 in. (0.25 in. thick)
Reduction ratio
5:1
High-productivity KrF scanner that reduces wafer handling and alignment times.
Wide-field KrF scanner with enhanced lens capabilities.
1. IoT: Internet of Things