104 wph
throughput speed
High-volume i-Line stepper for IoT1 and MEMS2 devices.
throughput speed
image resolution quality
non-contact wafer stage
optical system and lens
The Canon FPA-3030i5+ delivers long-term solutions for device manufacturers. Configured to support optional equipment, the stepper can accommodate specialist wafer materials, including silicon and sapphire.
Maintain 40 nm overlay accuracy, even with imaging resolution below 350nm.
Wafer sizes range from 100mm to 200mm to meet precise productivity requirements.
Improved throughput thanks to modernised electrical control and focus systems.
Wafer size
200 mm; 150 mm
Resolution
≤ 350 nm
Exposure area
22 mm x 22 mm
Overlay accuracy
≤ 40 nm
Reticle size
6 in.
Reduction ratio
5:1
Productivity
≥104 wafers per hour (200 mm)
≥120 wafers per hour (150 mm)
High resolution, wide-field i-Line stepper for large-field device imaging.
High resolution, wide-field i-Line stepper for large-field device imaging.
i-Line stepper supporting higher-integration-levels and thinner-package devices.
1. IoT: Internet of Things
2. MEMS: An abbreviation of "Micro Electro Mechanical Systems" which are devices having micron-level mechanical structures such as collecting sensors and actuators that are integrated with electronic circuitry.