≦ 500 nm
resolution
Product
Canon FPA-5510iX Stepper
High-resolution imaging across a large exposure field.
≦ 50 nm
overlay accuracy
52 mm x 56 mm
exposure area
One-shot
exposure for large chip sizes
Large-field exposure without stitching
Capable of 0.5 µm resolution across a large exposure area, the Canon FPA-5510iX stepper can perform one-shot exposure for larger-than-normal chip sizes, improving both image quality and productivity.
Large field
Cover image sensors and MEMS¹ applications with a larger exposure field.
Stable performance
Support front-end-of-the-line semiconductor manufacturing and back-end processes.
Process options
Optimise equipment with extensive optional functions, including WB-OAS², LOX3, EAGA4.
Product Specifications
Wafer size
300 mm, 200 mm
Overlay accuracy
≤ 50 nm (|m|+3)
Resolution
≦ 500 nm
Numerical Aperture (NA)
0.28 ~ 0.37
Exposure area
52 mm x 56 mm
Reticle size
6 in. (0.25 in. thick)
Revolutionise your front-end-of-the-line processes with the Canon FPA-5510iX Stepper
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Find out how Canon Industrial Products can accelerate your business
1. MEMS: An abbreviation of "Micro Electro Mechanical Systems" which are devices having micron-level mechanical structures such as collecting sensors and actuators that are integrated with electronic circuitry.
2. WB-OAS (Wideband-Off-Axis Scope): Optional function that provides a wide-range of alignment light wavelengths to the OAS for wafer alignment. By covering the wavelength band from the visible light to the infrared, it is possible to perform stable alignment in most display and color-filter processes and in a backside illumination sensor process, it is also possible to align marks on the back side of a silicon wafer.
3. LOX (Low-Oxygen Exposure): Optional stepper function that reduces the oxygen concentration in the wafer lens area, which can increase photoresist reaction sensitivity and reduce required exposure doses which in turn improves overlay accuracy and productivity.
4. EAGA (Extended Advanced Global Alignment): Optional stepper function to correct for "nonlinear overlay error components" that cannot be corrected using standard AGA sampling and linear compensation. EAGA enables shotby-shot direct position measurement for all exposure fields to improve overlay accuracy.
5. IoT: Internet of Things
