≦ 1 µm
resolution
Product
Canon FPA-5520iV Stepper
Enhanced BEOL and FOWLP functionality for optimised production.
52 mm x 34 mm
exposure area
≦ 150 nm
overlay accuracy
FOWLP
Fan out wafer level packaging
The solution to next-generation packaging challenges
The Canon FPA-5520iV is a high performance i-Line stepper with superior resolution and imaging performance. Meet new challenges, such as fan-out wafer level packaging (FOWLP), via new wafer handling and chucking systems.
Flexible vacuum pads
Enhanced support for warped wafers and chip alignment variations from reconstitution.
Faster exposure
Improved high-intensity illumination optics system for thick photo-resist processes.
Proven technology
Includes projection lens optics and alignment system for high-precision overlay accuracy.
Product Specifications
Resolution
≤ 1.0 µm
Wafer size
300 mm
Reticle size
6 in. (0.25 in. thick)
Reduction ratio
2:1
Exposure area
52 mm x 34 mm
Overlay accuracy
≤150 nm (|m| + 3σ)
Lower your semiconductor lithography production costs with the Canon FPA-5520iV
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